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35 x 35 x 35 mm
3M9448B pad

5192a aluminum BGA heatsink 35x35x10 mm.JPG

A cross-cut heatsink is a type of heatsink design where the surface or fins are cut in a crisscross or grid-like pattern. This design increases the surface area available for heat dissipation and enhances airflow through the heatsink, improving its thermal performance.

Heatsinks

  • BGA Chipset Heatsinks

30 x 30 x 10 mm
3M9448B pad

5191a aluminum BGA heatsink 30x30x10 mm.JPG

A BGA heatsink refers to a heatsink used to dissipate heat from a Ball Grid Array (BGA) package. BGA is a type of surface-mount packaging used for integrated circuits (ICs), and it can generate significant heat, especially in high-performance applications GPUs, CPUs, FPGAs, and ASICs. 

28 x 28 x 15 mm
3M9448B pad

518a aluminum BGA heatsink 28x28x15 mm.jpg

A BGA heatsink refers to a heatsink used to dissipate heat from a Ball Grid Array (BGA) package. BGA is a type of surface-mount packaging used for integrated circuits (ICs), and it can generate significant heat, especially in high-performance applications GPUs, CPUs, FPGAs, and ASICs.

28 x 28 x 11 mm
3M9448B pad

517a aluminum BGA heatsink 28x28x11 mm.JPG

FPGAs (Field-Programmable Gate Arrays) are widely used in data centers, 5G infrastructure, aerospace, and AI acceleration systems. As these devices handle increasingly complex workloads, efficient heat dissipation becomes critical. Without proper cooling, FPGA performance and reliability can quickly degrade.

21 x 21 x 15 mm
3M9448B pad

514a aluminum BGA heatsink 21x21x15 mm.JPG

As FPGAs (Field-Programmable Gate Arrays) become more powerful, managing heat is more important than ever. Whether you're working with Xilinx, Intel (formerly Altera), or another brand, selecting the right FPGA heatsink ensures reliable performance and long-term stability.

25 x 25 x 10 mm
Sekisui 5760 pad

515a aluminum BGA heatsink 25x25x10 mm.JPG

Ball Grid Array (BGA) packages and heatsinks are essential for thermal management, especially in high-power applications like GPUs, CPUs, FPGAs, and networking chips. Below is a detailed breakdown of BGA heatsink options, selection criteria, and purchasing recommendations

28 x 28 x 8 mm
3M9448B pad

516a aluminum BGA heatsink 28x28x8 mm.JPG.JPG

Ball Grid Array (BGA) packages, heatsinks are essential for thermal management, especially in high-power applications like GPUs, CPUs, FPGAs, and networking chips. Below is a detailed breakdown of BGA heatsink options, selection criteria, and purchasing recommendations.

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